HPQ Announces a Debt Settlement In Shares
MONTREAL, July 22, 2026 (GLOBE NEWSWIRE) -- HPQ Silicon Inc. (“HPQ” or the “Company”) (TSX-V: HPQ, OTCQB: HPQFF, FRA: O08), a technology company focused on innovation in advanced materials and critical process technologies, is pleased to announce that the Corporation has negotiated an agreement with a creditor of the Corporation (Creditor) regarding the payment in units of the Corporation, at a premium to market, in lieu of cash. As a result of this request, the Corporation’s Board of Director
MONTREAL, July 22, 2026 (GLOBE NEWSWIRE) -- HPQ Silicon Inc. (“HPQ” or the “Company”) (TSX-V: HPQ, OTCQB: HPQFF, FRA: O08), a technology company focused on innovation in advanced materials and critical process technologies, is pleased to announce that the Corporation has negotiated an agreement with a creditor of the Corporation (Creditor) regarding the payment in units of the Corporation, at a premium to market, in lieu of cash. As a result of this request, the Corporation’s Board of Directors has approved the settlement agreement of outstanding debts totaling $70,625 owed to an arm’s-length creditor for services rendered to Company between May 2025 and July 2026.
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